Thermal Management Of Electronics : Basics To Advanced Level
Become Thermal Analyst/Expert
What you will learn
The Reasons Behind The Need Of Thermal Management In The Field Of Electronics
Thermal Management Challenges At “Component Level”
Thermal Management Challenges At “PCB Level”
Thermal Management Challenges At “Packaging Level”
Concept Of “Skin Temperature”
Modes Of Heat Transfer : Conduction / Convection & Radiation With Illustration
The Concept Of - Newton’s Law Of Cooling (NLC) In Thermal Management
How To Calculate 'Heat Flow Rate' And 'Thermal Resistance' In Parallel Connected Conductors
Derivation On : Total Heat Flux & Total Thermal Resistance
Role Of WIEDEMANN FRANZ LAW In Thermal And Electrical Equivalent Relationships
Analog Between Thermal Circuit And Electrical Circuit
Which Aluminium Alloy Is Best For Thermal Management ?
Which Copper (Cu) Alloys Is Used To Manufacture Heat Sink ?
Al_Alloys Versus Cu_Alloys
Role Of Thermal Interface Materials (TIMs) In Thermal Management
In-depth Knowledge On Currently Used Thermal Management Techniques : Thermal Pads / T.L.G.F / Thermal Gels / Thermal Paste
Concept & Application Of PCM (Phase Change Material)
4 Important Thermal Designs Rules
Current Advanced Thermal Management Materials : Al-Diamond / Cu-Diamond / AlSiC / AlSi
Why take this course?
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Hello ,
My Name Is Riya Pal & I Welcome You To This Course .
In This World Of Fast Growing Electronics Technology , 1000 Of New Electronics Products Are Launched In The Market Place Every Day And In Every Field Of Electronics Such As Consumer Electronics , Medical Electronics , Defence Electronics , Aerospace Electronics , Communication Electronics & Industrial Electronics. Because Of MINIATURIZATION So As To Make Electronics Devices Handy To Use , Over Heating Of The Electronics Devices Has Become A Serious Problem Because This Has Resulted In The Reduction Of The Lifespan Of The Components As Well As Has Lowered The Safety Level .
This Course Has Been Designed Looking At The Requirement By The Students . Through This Course , Students Will Come To Know The Existing Scenario Of The Electronics World . This Course Will Provide You In-Depth Knowledge On The Below Topics :
Course Introduction
The Reasons Behind The Need Of Thermal Management In The Field Of Electronics
Thermal Management Challenges At “Component Level”
Thermal Management Challenges At “PCB Level”
Thermal Management Challenges At “Packaging Level”
Concept Of “Skin Temperature”
Modes Of Heat Transfer : Conduction / Convection & Radiation With Illustration
Newton’s Law Of Cooling (NLC) In Thermal Management
How To Calculate 'Heat Flow Rate' And 'Thermal Resistance' In Parallel Connected Conductors
Derivation On : Total Heat Flux & Total Thermal Resistance
Role Of WIEDEMANN FRANZ LAW In Thermal And Electrical Equivalent Relationships
Analog Between Thermal Circuit And Electrical Circuit
Which Aluminium Alloy Is Best For Thermal Management ?
Which Copper (Cu) Alloys Is Used To Manufacture Heat Sink ?
Al_Alloys Versus Cu_Alloys
Role Of Thermal Interface Materials (TIMs) In Thermal Management
In-depth Knowledge On Currently Used Thermal Management Techniques : Thermal Pads / T.L.G.F / Thermal Gels / Thermal Paste
Concept & Application Of PCM (Phase Change Material)
4 Important Thermal Designs Rules
Current Advanced Thermal Management Materials : Al-Diamond / Cu-Diamond / AlSiC / AlSi
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